Microprocessor families: Microchip PICs (12X, 16X, and 18X), Sunplus (SPC series), Motorola 68HC11/12, ARM7 core, TI MSP430X2XX family embedded x86, Winbond
Software: Assembly (SunPlus, PIC), C, National Instruments LabView, Winbond Power Speech
Communications: RS-232, SPI, I2C, MIDI, custom for wireless communications (RF and IR)
Circuit design: Digital logic, discrete transistor designs, Motor Drivers (Servo and Stepper), numerous special purpose ICs, power supplies using Eagle Schematic capture
PCB design and layout: Eagle PCB layout
Mechanical design: Solidworks 3D solid modeling
Other systems: Character LCDs, Tern Smart LCD, thermal control (PID), several sensing technologies
Manufacturing and prototyping: In-house lathe and CNC mill. Good relationships with vendors capable of quick-turn PCB fabrication, laser cutting, laser milling, machining, metal extrusion, casting, sheet metal fabrication and 3D rapid prototyping